发明名称 |
MOLDING PAPER AND PAPER MOLDED ARTICLE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide molding paper capable of being molded into a paper molded article having an IC chip inlet sheet mounted therein and capable of preventing the falling or repapering of the IC chip inlet sheet, and the paper molded article molded from the molding paper. <P>SOLUTION: The molding paper is constituted by laminating base materials 2 and 3 comprising stretched paper and laminating the IC chip inlet sheet 5 to the base materials 2 and 3 through an adhesive layer 4. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007098581(A) |
申请公布日期 |
2007.04.19 |
申请号 |
JP20050287426 |
申请日期 |
2005.09.30 |
申请人 |
NIPPON PAPER INDUSTRIES CO LTD |
发明人 |
TAKAHASHI TAKESHI;OGAWA HIDENORI;OUGIMOTO MASATO;KATO MASATSUGU |
分类号 |
B32B27/10;B65D1/00;B65D65/40;D21H21/48;D21H27/30;G06K19/07;G06K19/077 |
主分类号 |
B32B27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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