| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type electronic part manufacturing method which is capable of reducing a thickness variation of the end face electrode of an electronic part. SOLUTION: The manufacturing method comprises processes of cutting first slits 20 on the surface of a sheet-like substrate 11, filling the first slits 20 with conductive paste 22, and cutting off the conductive paste 22 by a second blade 24 smaller in width than the first slit 20 to form end face electrodes 25. COPYRIGHT: (C)2007,JPO&INPIT
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