| 摘要 |
A floor board bonding and forming method for construction and a floor board are provided to simultaneously bond an upper plate, a body, and a lower plate with one process of injecting a filling material into the interior of a lower mold and a side surface mold. A floor board for construction includes a body(21), an upper plate(23), a lower plate(22), and side surface plates. The body forms a middle layer. The upper plate is bonded to an upper portion of the body. The lower plate is bonded to a lower portion of the body. The surface side plates are integrally formed at the periphery of the body, the upper plate, and the lower plate to bond the body, the upper plate, and the lower plate. The side surface plates are integrally formed at the periphery of the body, the upper plate, and the lower plate by injecting a filling material into a lower mold and a side surface mold. |
