发明名称 |
Lamination type electronic component |
摘要 |
A lamination type electronic component includes spiral conductor patterns which are substantially quadrilateral and are electrically connected to each other through a via hole formed in a ceramic insulating layer so as to constitute a coil. The conductor patterns are arranged so that the center in the width direction of the sides extending in the Y-axis direction of the one conductor pattern may be positioned at the inside edges of the sides extending in the Y-axis direction of the other conductor pattern.
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申请公布号 |
US7327207(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20050143281 |
申请日期 |
2005.06.02 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
ASAKAWA KEIJI |
分类号 |
H03H7/01;H01F5/00;H01F27/28 |
主分类号 |
H03H7/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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