发明名称 Lamination type electronic component
摘要 A lamination type electronic component includes spiral conductor patterns which are substantially quadrilateral and are electrically connected to each other through a via hole formed in a ceramic insulating layer so as to constitute a coil. The conductor patterns are arranged so that the center in the width direction of the sides extending in the Y-axis direction of the one conductor pattern may be positioned at the inside edges of the sides extending in the Y-axis direction of the other conductor pattern.
申请公布号 US7327207(B2) 申请公布日期 2008.02.05
申请号 US20050143281 申请日期 2005.06.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 ASAKAWA KEIJI
分类号 H03H7/01;H01F5/00;H01F27/28 主分类号 H03H7/01
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