发明名称 |
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same |
摘要 |
A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above. |
申请公布号 |
US9374913(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201414478332 |
申请日期 |
2014.09.05 |
申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
Saijo Yoshikazu;Yamamoto Hisamitsu;Utsumi Masayuki;Okamachi Takuya;Komeda Takuya |
分类号 |
C23C18/16;C23C18/20;H05K3/18;H05K3/38 |
主分类号 |
C23C18/16 |
代理机构 |
Wenderoth, Lind & Ponack, L.L.P. |
代理人 |
Wenderoth, Lind & Ponack, L.L.P. |
主权项 |
1. A pretreatment agent for electroless plating, comprising:
a fluorine compound; a surfactant; and at least one solvent selected from the group consisting of ethylene-based glycol butyl ethers of formula:
C4H9—(OC2H4)m—OHwhere m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula:
C4H9—(OC3H6)n—OHwhere n is an integer of 1 to 4,
wherein the pretreatment agent for electroless plating has a pH of 3.1 or lower. |
地址 |
Osaka JP |