| 摘要 |
An electronic device module according to an embodiment of the present invention may include a first substrate which has a double-sided mounting electrode, a plurality of first electronic components mounted on one surface of the first substrate, a second substrates which is bonded to the other surface of the first substrate to form a cavity, a third substrate which is bonded to the other side of the first substrate and divides the cavity into multiple regions, and a plurality of second electronic components which are arranged on the divided regions and are mounted on the other side of the first substrate. So, the generation of cracks in a soldering can be prevented. |
