SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

摘要

A semiconductor device according to various embodiments of the present invention may include a base substrate which has a semiconductor chip mounted on one surface thereof; a plurality of solder bumps which are arranged in a first region on the other surface of the base substrate; at least one resin groove which is formed in a second region different from the first region on the other surface of the base substrate; and a bonding resin which is filled in the resin groove. The semiconductor device can be installed on a printed circuit board of an electronic device by the bonding resin. The semiconductor device and an electronic device having the same according to the present invention can be variously implemented according to an embodiment.