发明名称 |
Method of fabricating self-aligned silicon carbide semiconductor devices |
摘要 |
Methods of constructing silicon carbide semiconductor devices in a self-aligned manner. According to one aspect of the invention, the method may include forming a mesa structure in a multi-layer laminate including at least a first and second layer of silicon carbide material. The mesa structure may then be utilized in combination with at least one planarization step to construct devices in a self-aligned manner. According to another aspect of the present invention, the mesa structure may be formed subsequent to an ion implantation and anneal steps to construct devices in a self-aligned manner. According to another aspect of the present invention, a high temperature mask capable of withstanding the high temperatures of the anneal process may be utilized to form devices in a self-aligned manner.
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申请公布号 |
US6764907(B2) |
申请公布日期 |
2004.07.20 |
申请号 |
US20030360662 |
申请日期 |
2003.02.07 |
申请人 |
VAN ZEGHBROECK BART J.;TORVIK JOHN T. |
发明人 |
VAN ZEGHBROECK BART J.;TORVIK JOHN T. |
分类号 |
H01L21/04;H01L29/24;H01L29/732;(IPC1-7):H01L21/336;H01L21/476 |
主分类号 |
H01L21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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