发明名称 Method of fabricating self-aligned silicon carbide semiconductor devices
摘要 Methods of constructing silicon carbide semiconductor devices in a self-aligned manner. According to one aspect of the invention, the method may include forming a mesa structure in a multi-layer laminate including at least a first and second layer of silicon carbide material. The mesa structure may then be utilized in combination with at least one planarization step to construct devices in a self-aligned manner. According to another aspect of the present invention, the mesa structure may be formed subsequent to an ion implantation and anneal steps to construct devices in a self-aligned manner. According to another aspect of the present invention, a high temperature mask capable of withstanding the high temperatures of the anneal process may be utilized to form devices in a self-aligned manner.
申请公布号 US6764907(B2) 申请公布日期 2004.07.20
申请号 US20030360662 申请日期 2003.02.07
申请人 VAN ZEGHBROECK BART J.;TORVIK JOHN T. 发明人 VAN ZEGHBROECK BART J.;TORVIK JOHN T.
分类号 H01L21/04;H01L29/24;H01L29/732;(IPC1-7):H01L21/336;H01L21/476 主分类号 H01L21/04
代理机构 代理人
主权项
地址