发明名称 |
METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE |
摘要 |
To cut out a bard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2 and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated. |
申请公布号 |
US2016243673(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
US201615090875 |
申请日期 |
2016.04.05 |
申请人 |
FUJI MANUFACTURING CO., LTD |
发明人 |
Mase Keiji;Chino Daisuke;Hinata Masato |
分类号 |
B24C3/18;B24C1/04;B24C3/32 |
主分类号 |
B24C3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |