An interconnection structure of a beamlet blanker array, a modulation device, a charged particle lithography system, and a conductive slab.

摘要

The invention relates to an interconnection structure of a beamlet blanker array (106) for use in charged particle lithography and in a power supply unit (300). The interconnection structure comprises: conductive slab (201) connecting the power supply unit to the beam let blanker array (106) and comprising conductive plates having a uniform thickness and a face terminating in edges, the conductive plates having their faces substantially parallel to each other, wherein the conductive plates are arranged for conducting a forward electrical current towards the beamlet blanker array (106), and one plate is arranged for conducting a return electrical current from the beamlet blanker array, such that a magnetic field surrounding the slab is substantially zero; wherein each conductive slab (201) is connected to the power supply connection (301) of the power unit and oriented substantially perpendicular to the surface of the blanker array (106) for connection thereto.