| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology which is capable of controlling the pin capacity of the semiconductor chip of a semiconductor integrated circuit device, without affecting the actions of the circuit of the device. SOLUTION: A semiconductor integrated circuit device is provided with a capacitance element C, which adjusts the pin capacitance of a semiconductor chips, and the element C is attached directly to a bonding pad in a region, other than the region between the bonding pad and an internal circuit. Therefore, the minimum value for the pin capacitance is secured. In addition, since the capacitance component of the element C does not appear on a signal path, the action of the circuit of the device is not affected, even if the capacity element C is provided. |
