LOW THERMAL EXPANSION CERAMICS

摘要

PROBLEM TO BE SOLVED: To provide an excellent ceramic base stock suitable for a component for manufacturing a semiconductor satisfying denseness, high stiffness, low thermal expansion and thermal conductivity at the same time.

SOLUTION: This ceramic has ≤7% porosity originating from closed cells of ≤5 μm average cell diameter, has ≥30 specific stiffness (Young's modulus (GPa)/density(g/cm3)), -3×10-7to 3×10-7/K coefficient of thermal expansion, and 3 to 50 W/mK thermal conductivity.

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