发明名称 METHOD FOR REMOVING THERMAL-HARDENED FRIT SEAL TO BE USED FOR ASSEMBLING ELECTRONIC PARTS
摘要 <p>PURPOSE: A method is provided to effectively remove a frit seal from electronic parts without generating noxious gas, while preventing an environmental contamination by reducing the discharge volume of wastes. CONSTITUTION: A method is characterized in that the removal of thermosetting glass from electronic parts is performed by using an aqueous solution of acid or salt containing sulfonic acid ion. The acid is one selected from a group consisting of sulfamic acid(NH2SO3H), toluene sulfonic acid(CH3C6H4SO3H) and sulfanilic acid(NH2C6H4SO3H). The salt is one selected from a group consisting of ammonium sulfamate(NH4SO3NH2) and sodium sulfosalicylate(NaO3SC6H3(OH)COOH2HO).</p>
申请公布号 KR100408492(B1) 申请公布日期 2003.11.24
申请号 KR19970075878 申请日期 1997.12.29
申请人 LEE, GI WON 发明人 LEE, GI WON
分类号 C03C15/00;C03C23/00;H01J9/26;H01J9/36;H01J9/50;H01J9/52;(IPC1-7):H01J9/36 主分类号 C03C15/00
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