发明名称 |
Multichip semiconductor device and memory card |
摘要 |
A plurality of semiconductor chips with the same structure are stacked to construct a multichip semiconductor device. In each of the semiconductor chips, an optional circuit is formed. In the optional circuit, fuses corresponding to the stacked-stage number of each chip are formed and the fuses are selectively cut off so as to permit each chip to individually receive a chip control signal.
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申请公布号 |
US6624506(B2) |
申请公布日期 |
2003.09.23 |
申请号 |
US20010837262 |
申请日期 |
2001.04.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SASAKI KEIICHI;SAKUI KOJI |
分类号 |
G06K19/077;H01L23/48;H01L23/525;H01L25/065;(IPC1-7):H01L23/48 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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