| 摘要 |
1,194,452. Moulding plastic substances. SIEMENS A.G. 18 April, 1968 [19 April, 1967], No. 18382/68. Heading B5A. [Also in Division H1] In the manufacture of electrical components, the components are carried by an electrode framework (e.g. of nickel-iron-cobalt alloy) which contains linking portions 2 designed to act as the sealing part for the halves of an injection or press mould. As shown semiconductor diodes (5) are each mounted on an electrode 4 and wired to an adjacent electrode 3 and the assembly is placed between the halves of an injection mould 10. When epoxy resin is forced through inlet 13 into the mould its egress is prevented by the linking portion 2. To complete the devices, the linking portions are cut away (at 8) and the resin portions 26 are cut away to separate the two diodes of each pair; finally the base strip of each set of components is severed to produce the individual devices. Transistors, integrated circuits, resistors, and capacitors may be similarly encapsulated. Reference has been directed by the Comptroller to Specification 1,125,428. |
