| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC card whose built-in parts such as an antenna coil or an IC module can be prevented from being deformed or broken due to the ejection pressure of external layer resin and a method for manufacturing the non-contact IC card. <P>SOLUTION: Built-in parts consisting of an antenna coil 1 and an IC module 2 connected thereto are arranged and fixed to a resin sheet 4 functioning as a board member so as to be formed as a primary molded part 10, and this primary molded part 10 is inserted into a die, and sealed with external layer resin 3 by ejection molding. <P>COPYRIGHT: (C)2003,JPO |
