| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a decomposition treating agent and a decomposition treating method capable of decomposing fluorocarbons such as CF<SB>4</SB>contained in an exhaust gas exhausted from a semiconductor manufacturing process and the like at a decomposition rate of ≥99.9% at a relatively low decomposition temperature of ≤1,000°C without deactivating the agent in a short time or exhausting a corrosive gas such as hydrogen fluoride. <P>SOLUTION: The decomposition treating agent comprises an aluminum compound and a lanthanoid compound as effective ingredients or an aluminum compound, a lanthanoid compound and an alkaline earth metal compound as effective ingredients. A fluorocarbon is decomposed by bringing the fluorocarbon into contact under heating with the above decomposition treating agent or by bringing the fluorocarbon into contact under heating with a treating agent comprising aluminum oxide as an effective ingredient and thereafter with a treating agent comprising a lanthanoid oxide and an alkaline earth metal oxide as effective ingredients. <P>COPYRIGHT: (C)2003,JPO |
