| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer board which is miniaturized and flattened, superior in weather resistance and easy to adjust the resistance and capacitance. <P>SOLUTION: The multilayer board 101 is provided with a ceramic multilayer board 102 formed of multiple ceramic layers 102a and resin layers 103a and 103b laminated on the upper main face of the ceramic multilayer board 102. First via conductors 104 are formed in the ceramic multilayer board 102, and a first surface conductor 105 is formed on the upper main face of the ceramic multilayer board 102. A first inner conductor 106 is formed between the ceramic layers 102a of the ceramic multilayer board 102, and second via conductors 114 are formed in the resin layers 103a and 103b. Second surface conductors 115 are formed on the upper main face of the resin layer 103b, and circuit parts 110a to 110c are disposed in the resin layers 103a and 103b. <P>COPYRIGHT: (C)2003,JPO |
