TAILLESS BONDER FOR FILAMENTARY WIRE LEADS

摘要

A bonding apparatus and method is disclosed for bonding an interconnecting filamentary wire between two contact pads of a semiconductor device without any significant tail. One form of the apparatus includes an upstanding bonding wedge having a flat side surface, a bonding surface, and a shoulder intersecting the flat side surface forming a wire shearing edge adjacent but not coplanar with the bonding surface. The outlet end of a wire guide tube is moved past the shearing edge and along the flatted surface to sever the wire adjacent the bond.