RECEPTACLE FOR CONNECTING SEMICONDUCTORS TO A CIRCUIT BOARD

摘要

A receptacle for installation on one surface of a circuit board for supporting a semiconductor package of the type having bonding pads along one side and providing an interconnection being the package and the circuit board. The receptacle has a generally channel-shaped planform with a series of contact members spaced apart along a central body section. The contact members extend upwardly and outwardly from one side and register with bonding pads of the package. The lower ends of the contact members extend through the circuit board for connection with lead terminals on its other surface.