发明名称 |
INTERCONNECTING CARRIER BODIES FOR SEMICONDUCTOR DEVICES |
摘要 |
Carrier bodies for semiconductor devices, each carrier having first and second pairs of spaced surfaces, the first pair of surfaces being spaced apart and complementary to the second pair of surfaces so that the first pair of surfaces of one carrier body may be engaged with the second pair of surfaces on a second carrier body, whereby a plurality of carrier bodies may be assembled to form a stack.
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申请公布号 |
US3701079(A) |
申请公布日期 |
1972.10.24 |
申请号 |
USD3701079 |
申请日期 |
1970.07.10 |
申请人 |
JAMES E. BOWDEN;WILLIAM L. GLICK |
发明人 |
JAMES E. BOWDEN;WILLIAM L. GLICK |
分类号 |
H01R13/514;H05K7/02;(IPC1-7):H01R13/60;B65D21/02 |
主分类号 |
H01R13/514 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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