发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for fabricating a semiconductor device is provided to accurately stop etching in a hetero-junction boundary when a hetero-junction structure is selectively etched by selectively eliminating an AlyGa1-yAs layer when light is irradiated. CONSTITUTION: The second semiconductor layer having a band gap smaller than that of the first semiconductor layer is disposed on the first semiconductor layer in a hetero-junction structure, wherein the energy of the valence band of the second semiconductor layer is larger than that of the first semiconductor layer. A metal layer is formed in the outside of the first portion from which the second semiconductor layer is removed. The metal layer is covered with a mask pattern exposing the first portion of the second semiconductor layer. A light irradiation process is performed to selectively remove the second semiconductor layer by using the mask pattern as a mask and etchant having a Fermi level higher than that of the second semiconductor layer.
|
申请公布号 |
KR20020090110(A) |
申请公布日期 |
2002.11.30 |
申请号 |
KR20020017338 |
申请日期 |
2002.03.29 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KAWAZU ZEMPEI;YAGI TETSUYA |
分类号 |
H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|