发明名称 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for fabricating a semiconductor device is provided to accurately stop etching in a hetero-junction boundary when a hetero-junction structure is selectively etched by selectively eliminating an AlyGa1-yAs layer when light is irradiated. CONSTITUTION: The second semiconductor layer having a band gap smaller than that of the first semiconductor layer is disposed on the first semiconductor layer in a hetero-junction structure, wherein the energy of the valence band of the second semiconductor layer is larger than that of the first semiconductor layer. A metal layer is formed in the outside of the first portion from which the second semiconductor layer is removed. The metal layer is covered with a mask pattern exposing the first portion of the second semiconductor layer. A light irradiation process is performed to selectively remove the second semiconductor layer by using the mask pattern as a mask and etchant having a Fermi level higher than that of the second semiconductor layer.
申请公布号 KR20020090110(A) 申请公布日期 2002.11.30
申请号 KR20020017338 申请日期 2002.03.29
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KAWAZU ZEMPEI;YAGI TETSUYA
分类号 H01L21/306;(IPC1-7):H01L21/306 主分类号 H01L21/306
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