METHODS OF AND APPARATUS FOR LOCATING SOLDER FAULTS

摘要

Solder faults occurring between the soldered circuit paths of a printed circuit board are visually located by filtering colored light reflected from the paths and faults with a filter of a configuration identical to the circuit paths. The light reflected from the paths passes through the filter and emerges a different color than the light reflected from the faults which is either unfiltered or filtered to remove different wave lengths of light. This filtration process results in images of the circuit paths being one color and images of the faults being another.