| 摘要 |
PURPOSE:To photopolymerizable composition which can provide a cured product having electrical properties useful for insulating materials for electrical appliances and devices, resists materials, etc., comprising an epoxy resin, an aluminum compound and a specified silicon compound. CONSTITUTION:The titled photopolymerizable composition is obtained by mixing an epoxy resin (e.g., one derived from bisphenol A) with an aluminum compound (one having an organic group selected from the group consisting of alkyl, phenyl, or a like group, e.g., trismethoxyaluminum) and a silicon compound of the formula (wherein R1 is a lower alkyl, lower unsaturated alkyl, or aromatic R2, R3, R4 and R5 are each H, a halogen, or an organic group such as alkyl, aryl, nitro, cyano or alkoxy, m is 0-2, n is 1-3, and m+n<=3). The amount of said silicon compound added is 0.1-20wt% based on the epoxy resin. |
