| 摘要 |
PURPOSE:To contrive improvement in dampproof property of the titled lead frame by a method wherein the wire bonding part located on the inner part of a lead is made higher than the other part. CONSTITUTION:The inner end side of the lead 2, arranged on the circumference of the island 1 whereon a semiconductor element 4 is fixed, is bent upward in stepped form. The wire bonding part 2a at the inner end of the lead 2, which will be connected with a bonding wire 4 to the electrode pad of the semiconductor element 4 fixed to an island 1, is formed higher than the other part, namely, the outer end side of the lead 2, in the exactly same height as the upper surface of the semiconductor element 4 in other words. As a result, the generation of the trouble in which the bonding wire 5 connecting between the electrode pad of the semiconductor element and the wire bonding part 2a located at the inner end of the lead is brought to come in contact with the corner of the edge of the semiconductor element is suppressed, and the moisture infiltrating into the internal part passing through the interface of the lead and sealing resin is prevented from the infiltration by the bent lead after the resin. |
