PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT,申请号JP19880296654-传众专利搜索

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发明名称	PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号	JPH02142167(A)	申请公布日期	1990.05.31
申请号	JP19880296654	申请日期	1988.11.22
申请人	NEC CORP	发明人	TSUSHIMA KAZUYOSHI
分类号	H01L23/08;H01L23/02;H01L23/04	主分类号	H01L23/08
代理机构		代理人
主权项
地址

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