| 摘要 |
PURPOSE:To avoid cracks in a circuit substrate and realize superior thermal conductivity by fixing the circuit substrate divided into a plurality of segments on a heat sink by using solder, and fixing a copper thin plate so as to bridge the divided circuit substrate. CONSTITUTION:Two circuit substrates 3a and 3b, on both surfaces of which conductor patterns are formed, are fixed on one heat sink 1 by using solder 2a, so as to be adjacent with each other. A copper thin plate 6a being a metal layer is fixed so as to bridge the two circuit substrates 3a and 3b, by using solder 2b. A semiconductor chip 4 is fixed on a mounting pad 8 by using solder 2c. An electrode pad of the semiconductor chip 4 and the copper thin plate are connected by using a metal thin wire 6. Thereby, thermal conductivity is improved and the generation of cracks in the circuit substrate can be prevented.
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