| 摘要 |
<p>An integrated circuit module that includes a plurality of layers (14, 26), each layer having one or more active components (10, 12) disposed thereon and an interconnect structure (34). The interconnect structure is supported by a substrate (30) with the active components either on the substrate or on the interconnect structure itself. The substrates (30) and their associated interconnect structure and active components are disposed in a stack with a low pressure epoxy resin (24). The epoxy resin layers act as both an adhesive and capsulate and also as an isolation layer. An interconnect structure is also provided on the opposite side of the substrate from the active component and provides an intermediate layer to which the epoxy resin is bonded. The epoxy resin layer is amenable to the active components. Plated-through holes (44) are provided between the interconnect structures on both sides of the substrates and also between various adjacent substrates.</p> |
