| 发明名称 |
Heat curable epoxy compositions |
| 摘要 |
A polysilanesiloxane such as a cyclic dimer of disilanesiloxane has been found to be useful in promoting the thermal cure of epoxides such as silicone epoxides. Enhancement in the rate of thermal cure of the epoxy compositions containing such polysilanesiloxanes can be effected with an effective amount of a platinum catalyst.
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| 申请公布号 |
US5180801(A) |
申请公布日期 |
1993.01.19 |
| 申请号 |
US19910754100 |
申请日期 |
1991.09.03 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WENGROVIUS, JEFFREY H.;VAN VALKENBURGH, VIRGINIA M. |
| 分类号 |
C08G59/02;C08G59/00;C08G59/30;C08G59/68;C08L63/00;C08L83/06 |
主分类号 |
C08G59/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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