| 摘要 |
PROBLEM TO BE SOLVED: To improve operatability of a multichip module, when a desired electrical circuit is constituted by using a multichip module, while requiring no additional member on which a wiring pattern is formed to assist this or simplifying the wiring pattern on the member. SOLUTION: This multichip module has a plurality of electrical components FET1, FET2, R1, R2, C1, 3, a frame 1 having a plurality of die pads on which the plurality of electrical components are mounted and a plurality of terminals 11a-11c connected electrically to the plurality of electrical components and a resin packaging 2 sealing the plurality of electrical components and other portions of the frame 1, so that parts of the terminals 11a-11c are exposed to the outside. The plurality of electrical components are connected electrically to each other via the frame 1. |
