发明名称 METHOD FOR GRINDING THERMOPLASTIC RESIN MOLD
摘要 <p>PURPOSE:To grind and recover an adhesive or hygroscopic waste thermoplastic resin mold satisfactorily without lowering a grinding capacity. CONSTITUTION:Water is sprayed to the interior of a rotary grinding machine 10 from a spray nozzle 15. Then the waste marginal part A of polyvinylbutyral film is supplied to the interior of the grinding machine 10. The waste marginal part is cooled by cooling water, then is cut to fraction B between a rotary blade 12 and a fixed blade 13, and further is cut to finer pieces C. These pieces are supplied to a screw feeder 20, passing through a screen 14 together with cooling water. Most of the cooling water is filtered using a drain screen 22. The ground piece on the drain screen 22 is supplied to a centrifugal dehydration device 30, and water sticking to the ground piece is centrifugally dehydrated. The ground piece thus centrifugally dehydrated is transferred to an air current dryer 60 and dried completely to be recovered.</p>
申请公布号 JPH05329396(A) 申请公布日期 1993.12.14
申请号 JP19920136754 申请日期 1992.05.28
申请人 SEKISUI CHEM CO LTD 发明人 MIKAZUKI MASAO
分类号 B02C18/00;B29B17/00;B29B17/04;B29K105/26;(IPC1-7):B02C18/44 主分类号 B02C18/00
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