LAMINATED JIG FOR MULTILAYERED PRINTED CIRCUIT BOARD

摘要

PURPOSE:To provide the lamination jig for a multilayered printed circuit board to which prepregs are hardly stickable and which has good pressing and supporting characteristics and excellent durability. CONSTITUTION:This lamination jig 10 to be used for holding the laminated material in the case of production of the multilayered printed circuit board by laminating the materials for the multilayered printed circuit board, such as copper foil or copper clad laminated plate for an outside layer, prepreg and copper clad laminated plate for an inside layer, in proper order and heating the laminate under pressurization is the lamination jig for the multilayered printed circuit board constituted by forming a composite plating film 14 composed of a metal and fluorine compd. formed by uniformly dispersing fluorine compds. into a metallic matrix on the surface of the lamination jig plate 11 on at least the side facing the laminated material mentioned above.