| 摘要 |
PURPOSE: To provide an epoxy resin composition for sealing, small in the coefficients of linear expansion of molded products, large in thermal conductivity, well maintaining moisture resistance reliability and little in abrasion, and further to provide a semiconductor device using the same. CONSTITUTION: The epoxy resin composition for sealing contains an inorganic filler in an amount of 50-90 wt.% based on the whole amount of the sealing epoxy resin composition. Therein, the inorganic filler contains at least one kind selected from the group of talc, enstatite, petalite,β-spodumene, wollastonite, anorthite, kaolin, mullite and cordierite, and the content of at least one kind of impurity selected from the group of Cl<-> , NO3 <-> , SO4 <2-> , Na<+> , NH4 <+> and K<+> is <=50ppm based on the whole amount of the inorganic filler. The epoxy resin composition for sealing can be used for sealing semiconductor elements loaded on lead frames.
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