发明名称 VACUUM TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To freely change the number of vacuum treatment chambers so as to correspond the process change and a run change by connecting at least two vacuum treatment apparatuses each of which is provided with a third conveyance means which conveys substrates one by one between a substrate delivery means installed so as to correspond to a vacuum treatment chamber on a first conveyance passage and a vacuum treatment chamber. SOLUTION: Substrates 30 are taken out one by one from a feed cassette 70, they are conveyed to a vacuum treatment chamber 20 via a buffer chamber 10 from a vacuum reserve chamber 60, and the substrates 30 which are treated one by one in the chamber are conveyed to the vacuum reserve chamber 60 via the buffer chamber 10 from the vacuum treatment chamber 20 so as to be collected in a collection cassette 71 one by one. A vacuum treatment apparatus which is constituted in this manner is used as one module, and at least two modules are installed so as to be connected via vacuum opening and shutting means 40, 41 without the intermediary of the buffer chamber 10. Thereby, the number of vacuum treatment chambers 20 is changed so as to correspond to a process change and a run change, and a system can be constituted or organized.
申请公布号 JPH09181149(A) 申请公布日期 1997.07.11
申请号 JP19970025170 申请日期 1997.02.07
申请人 HITACHI LTD 发明人 KAKEHI YUTAKA;NAKAZATO NORIO;FUKUSHIMA YOSHIMASA;SHIBATA FUMIO;TSUBONE TSUNEHIKO;KANAI NORIO
分类号 B01J3/00;H01L21/02;H01L21/205;H01L21/302;H01L21/3065;H01L21/677;H01L21/68;(IPC1-7):H01L21/68;H01L21/306 主分类号 B01J3/00
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