发明名称 ADHESIVE FOR CONDUCTIVE TILE AND CONDUCTIVE FLOOR PREPARED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive which is used for bonding conductive tiles to floor surfaces and can be applied without detriment to external appearance by compounding a resin with specified amts. of needle-like titanium oxide and/or a stainless steel filler. SOLUTION: 100 pts.wt. resin is compounded with 5-55 pts.wt. needle-like titanium oxide and/or 1-5 pts.wt. stainless steel filler. The resin is pref. an epoxy resin. Needle-like titanium oxide particles having aspect ratios of 2.5-120, breadths of 0.05-0.4μm, and lenghts of 1-6μm are suitable. A needle-like or fibrous stainless steel filler having an aspect ratio of 100-2,000, a breadth of 5μm or lower, and a length of 5 mm or lower is suitable. The adhesive can be colored variously by compounding 5-10 pts.wt. colorant based on 100 pts.wt. resin. A curative is also compounded to cure the adhesive.
申请公布号 JPH10338855(A) 申请公布日期 1998.12.22
申请号 JP19970152359 申请日期 1997.06.10
申请人 SUMITOMO RUBBER IND LTD 发明人 KAWAHARA SATORU
分类号 E04F15/18;C04B111/94;C09J9/02;C09J11/04;H01B1/22;H05F1/00;(IPC1-7):C09J9/02 主分类号 E04F15/18
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