发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURE |
摘要 |
A lead frame 24 comprising an inner lead 22 and outer lead 23 is sealingly filled from a through-hole into a package 21. A CCD chip 27 is inserted from an inlet 26 into the package 21. An electrode pad 28 is connected to the inner lead 22 via a bump 29 to complete an optical positioning and an electrical connection, then the positions of these components are fixed by glue. As a result, a solid-state image sensing apparatus can be manufactured at a low cost, and an accurate positioning can be realized. Thus, the solid-state image sensing apparatus can be employed to a video camera of high quality picture to reproduce vivid colors and fine pictures. <IMAGE> |
申请公布号 |
EP0790652(A4) |
申请公布日期 |
1998.12.09 |
申请号 |
EP19960925131 |
申请日期 |
1996.07.30 |
申请人 |
MATSUSHITA ELECTRONICS CORPORATION |
发明人 |
SANO, YOSHIKAZU;TERAKAWA, SUMIO;TSUJII, EIICHI;ASAUMI, MASAJI;CHATANI, YOSHIKAZU |
分类号 |
H01L27/148;H01L31/02;H01L31/0203;(IPC1-7):H01L27/148 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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