| 摘要 |
A multichip module, or MCM, comprises stacked chips 110, 120, and a substrate with two interconnection patterns 131, 132. One of the chips has interconnection pads on an upper surface, and the other has pads on a lower surface. In one embodiment, the bottom chip 110 is connected to pads on the substrate by solder bumps, and the top chip is connected via wire bonds 142. An alternative arrangement (fig. 9) has an upper chip connected to the lower chip by solder bumps, with connection to the substrate via wire bonds. The upper chip may be of equal or greater area than the lower chip (fig. 6). |
