| 摘要 |
PROBLEM TO BE SOLVED: To improve the soldering structure of a metallic cap for the substrate of a microchip module, and to further reduce the size and weight of the microchip module. SOLUTION: A metallic cap 40 is fitted onto a substrate 30, where chip parts are mounted and is soldered to a junction part 33 of the substrate 30 via a through-hole 44, that is punched at a nib part 43 of the metallic cap 40, thus eliminating the need for space for soldering around the nib part 43, and hence further reducing the size and weight of the microchip module.
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