Micromechanical component used as a pressure sensor comprises a semiconductor functional layer on a substrate, a hollow chamber arranged between the substrate and the functional layer, and distance spacers arranged on the substrate

摘要

Micromechanical component comprises a semiconductor substrate (10); a semiconductor functional layer (50) epitaxially grown on the substrate; a hollow chamber (300) arranged between the substrate and the functional layer and defining a membrane region (M) of the functional layer; and one or more distance spacers (40) arranged on the substrate below the membrane region. An Independent claim is also included for a process for the production of the component comprising forming a sacrificial layer (30) on a semiconductor substrate (10); structuring the sacrificial layer to define a hollow chamber to be formed later and a membrane region (M) above; epitaxially growing a semiconductor functional layer (50) on the substrate with the structured sacrificial layer; forming an insulating layer (60); providing etching channels (110) in the membrane region and/or in the periphery of the membrane region to etch the sacrificial layer; etching the sacrificial layer; closing the channels; and providing distance spacers (40) to prevent adhesion of the membrane region to the substrate.