| 摘要 |
PROBLEM TO BE SOLVED: To increase a low frequency side attenuation quantity at outside a passband without deteriorating the insertion loss of the passband. SOLUTION: Ground side bonding pads 91A and 101A of IDT 91 and 101 in parallel arm resonators 90 and 100, ground side bonding pads 92A and 102A of left reflectors 92 and 102 and ground side bonding pads 93A and 103A of right reflectors 93 and 103 are completely electrically separated. The respective bonding pads 91A, 101A... are connected to a ground electrode 113 on the side of a package 110 with the conductors of separate independent wires 91W, 101W.... Thus, the isolation of the parallel arm resonators 90 and 100 is remarkably improved.
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