MEMBER FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A member for manufacturing a semiconductor package is provided to easily perform a singulation process and to prevent the load of a singulation punch regarding a singulation line from being concentrated, by forming a slot hole in a portion except four corners of the singulation line of the member having a strip type. CONSTITUTION: A plurality of semiconductor package regions are formed in the member for manufacturing the semiconductor package of a strip type. The slot hole(20) is formed in the portion except the four corners of the singulation line(30) of the member. The member is a printed circuit board(10) or circuit film of a strip type.