METHOD FOR CONTINUOUSLY PROCESSING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide the method of continuously processing a substrate, which can continuously perform a work processing for manufacturing a circuit board on the short substrate and can easily transport the substrate and position the substrate in respective work processing processes and whose processing efficiency can be improved. SOLUTION: In the processing method, the work processing for manufacturing a circuit is performed in the substrate 1. The end parts of a plurality of the substrates 1 are connected and a connection substrate 2 in a long sheet shape is formed. The connection substrate 2 is continuously worked. It is desirable that the substrates 1 are connected by sticking tape materials 3 from the end part of one substrate 1 to the end part of the other substrate 1 in the end part of the adjacent substrates 1.