| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which is used in the high frequency band of not less than 1 HGz, is manufactured by the lamination of prepreg, can suppress the dislocation of a conductor pattern to be small, which is superior in moldability, which is advantageous in loss and transmission speed and which has a low dielectric constant and to provide an electronic module. SOLUTION: The component is provided by stacking works where conductor pattern formed of copper foil is fixed in prepreg. Thus, an inductor, a capacitor, a resonator and an antenna element or the composite element of them are laminated inside or the surface of a substrate to form the component. Prepreg is obtained by mixing 15 to 65 vol.% of dielectric powders in resin. The dielectric constant of the substrate is 2.5 to 5.0 and the value of Q is not less than 90.
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