| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type capacitor which has enough bonding strength with respect to a mount substrate when soldered on it to overcome a problem to be solved in the conventional chip type capacitor, and which also has a structure having enough strength against shock and vibration applied from outside after being mounted. SOLUTION: Lead wires 3 extracted from one and the same end face are formed with steps 6, and external terminals 7 are formed with projecting part 6 on the connecting surfaces with the lead wires 3. The projecting parts 6 are caused to cut in into the steps 6 of the lead wires 3 to fix the external terminals 7. It is therefore possible to provisionarily fasten the lead wires 3 and the external terminals 7 to each other. Due to this structure, even after the capacitor is mounted on the mount substrate, the capacitor is provided with enough shockproof property against shock from outside.
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