METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method by which a printed wiring board having superior connectability and reliability can be manufactured by forming solder bumps which do not cause any short circuit among them. SOLUTION: This method of manufacturing multilayer printed wiring board includes a resin layer forming step (a) of forming a resin layer for resist on solder resist layers, a resist forming step (b) of forming resists for printing solder paste having through holes which are made to communicate with solder bump forming openings in the portions of the openings by performing exposure and development or laser machining on the resin layer for resist, and a solder paste printing step (c) of printing solder paste in the solder bump forming openings through the resists for printing solder paste. This method also includes at least a solder bump forming step (d) of forming solder bumps by causing the solder paste printed in the openings in the step (c) to reflow and a resist removing step (e) of peeling or removing the resists for printing solder paste.