| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can solve the problem raised when wiring having a thickness of >=30μm is formed by simultaneously baking the wiring with an insulating substrate that the substrate warps, the resistance of the substrate increases, and disconnection, etc., is caused by the cracking or peeling of the wiring. SOLUTION: This wiring board is provided with the insulating substrate 1 composed of an AlN sintered compact containing AlN as the main ingredient and sintering aids and a wiring conductor layer 4 having a thickness of >=30μm on or in the substrate 1. The conductor layer 4 contains a metallic component composed mainly of at least one kind of metal selected out of molybdenum and tungsten and a ceramic component in an amount of 5-15 wt.% per 100 wt.% of the metallic component. The ceramic component contains AlN and sintering aids and the ratio of the content of the sintering aids to that of AlN in the wiring conductor layer 4 is made 3-6 times as high as that of the content of the sintering aids to that of the metallic component in the AlN sintered compact. |
