ELECTRONIC COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting device of a structure, wherein electronic component is superior in its reliable connection for wire bonding parts. SOLUTION: In this electronic component mounting device 1, a plurality of plated through-holes 10 for interlayer connection are formed in the outer peripheral part of a semiconductor chip mounting region 9 on a multilayer board. The lines of bonding pads 13 are formed on the outer peripheral parts of the holes 10. The holes 10 are filled with sealing mediums 15. A rugged structure 31 for preventing the sealing mediums 15 from being drifted is provided on the region between the holes 10 and the lines of the bonding pads 13.