发明名称 |
POLISHING DEVICE AND METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To obtain high degree of flatness and stable management of film thickness by performing polishing after dressing stably. SOLUTION: In a polishing device provided with a top ring device polishing by bringing a face to be polished of a material to be polished into contact with a polishing tool face on a turn table and a dressing device 22 dressing by bringing a dressing member into contact with the polishing tool face, a temperature controller 23 controlling a temperature of the dressing member in advance and/or during dressing is provided. |
申请公布号 |
JP2000343416(A) |
申请公布日期 |
2000.12.12 |
申请号 |
JP19990151881 |
申请日期 |
1999.05.31 |
申请人 |
EBARA CORP |
发明人 |
SAKURAI KUNIHIKO;KATSUOKA SEIJI |
分类号 |
B24B37/015;B24B49/14;B24B53/017;H01L21/304 |
主分类号 |
B24B37/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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