发明名称 POLISHING DEVICE AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain high degree of flatness and stable management of film thickness by performing polishing after dressing stably. SOLUTION: In a polishing device provided with a top ring device polishing by bringing a face to be polished of a material to be polished into contact with a polishing tool face on a turn table and a dressing device 22 dressing by bringing a dressing member into contact with the polishing tool face, a temperature controller 23 controlling a temperature of the dressing member in advance and/or during dressing is provided.
申请公布号 JP2000343416(A) 申请公布日期 2000.12.12
申请号 JP19990151881 申请日期 1999.05.31
申请人 EBARA CORP 发明人 SAKURAI KUNIHIKO;KATSUOKA SEIJI
分类号 B24B37/015;B24B49/14;B24B53/017;H01L21/304 主分类号 B24B37/015
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