| 发明名称 |
Photodiode mit integrierter Halbleiterschaltung und Verfahren zur Herstellung |
| 摘要 |
<p>A semiconductor circuit in a semiconductor body and a wafer bonding method for connecting the semiconductor circuit to another substrate, in which a diode is realized in a laminar structure. The semiconductor circuit is connected to the terminals of the diode by means of feedthroughs that extend through the semiconductor body.</p> |
| 申请公布号 |
DE102005026242(B4) |
申请公布日期 |
2007.05.03 |
| 申请号 |
DE20051026242 |
申请日期 |
2005.06.07 |
| 申请人 |
AUSTRIAMICROSYSTEMS AG |
发明人 |
MEINHARDT, GERALD;SCHRANK, FRANZ;VESCOLI, VERENA |
| 分类号 |
H01L27/14;H01L27/06;H01L27/12 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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