发明名称 POLISHING SOLUTION FOR METAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing solution for metal which comprises colloidal silica whose surface is partially covered with aluminum atom as a solid abrasive grain and can restrain residual of the solid abrasive grain on a polishing surface after polishing. <P>SOLUTION: The polishing solution comprises (a) colloidal silica whose surface is partially covered with aluminum atom, (b) organic acid, (c) passive film forming agent, and (d) at least one kind selected from cationic surfactant, nonionic surfactant and water soluble polymer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007220995(A) 申请公布日期 2007.08.30
申请号 JP20060041363 申请日期 2006.02.17
申请人 FUJIFILM CORP 发明人 NISHIWAKI YOSHINORI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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